TPS650244
- 1.6-A, 1.0-A, or 0.8-A, 97% Efficient Step-Down Converter for System Voltage (VDCDC1)
- 3.3 V or 2.80 V or Adjustable
- 1.6-A, 1.0-A, or 0.8-A, up to 95% Efficient Step-Down Converter for Memory Voltage (VDCDC2)
- 1.8 V or 2.5 V or Adjustable
- 0.8-A, 90% Efficient Step-Down Converter for Processor Core (VDCDC3)
- Two Selectable Voltages for VDCDC3
- TPS650240:
- DEFDCDC3 = LOW: VO = 1.0 V
- DEFDCDC3 = HIGH: VO = 1.3 V
- TPS650241:
- DEFDCDC3 = LOW: VO = 0.9 V
- DEFDCDC3 = HIGH: VO= 1.375 V
- TPS650242:
- DEFDCDC3 = LOW: VO = 1.0 V
- DEFDCDC3 = HIGH: VO = 1.5 V
- TPS650243:
- DEFDCDC3 = LOW: VO = 1.0 V
- DEFDCDC3 = HIGH: VO = 1.2 V
- TPS650244:
- DEFDCDC3 = LOW: VO = 1.55 V
- DEFDCDC3 = HIGH: VO = 1.6 V
- TPS650245:
- DEFDCDC3 = LOW: VO = 0.9 V
- DEFDCDC3 = HIGH: VO = 1.1 V
- TPS650240:
- 30-mA LDO for Vdd_alive
- 2 × 200-mA General-Purpose LDOs (LDO1 and LDO2)
- Dynamic Voltage Management for Processor Core
- LDO1 and LDO2 Voltage Externally Adjustable
- Separate Enable Pins for Inductive Converters
- 2.25-MHz Switching Frequency
- 85-μA Quiescent Current
- Thermal Shutdown Protection
All trademarks are the property of their respective owners.
The TPS65024x devices are integrated power management ICs for applications powered by one Li-Ion or Li-Polymer cell, which require multiple power rails. The TPS65024x provide three highly efficient, step-down converters targeted at providing the core voltage, peripheral, I/O, and memory rails in a processor-based system. All three step-down converters enter a low power mode at light load for maximum efficiency across the widest possible range of load currents. The converters can be forced into fixed-frequency PWM mode by pulling the MODE pin high.
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查看全部 3 類型 | 標(biāo)題 | 下載最新的英語版本 | 日期 | |||
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* | 數(shù)據(jù)表 | TPS65024x Power Management ICs for Li-Ion Powered Systems 數(shù)據(jù)表 (Rev. C) | PDF | HTML | 2016年 1月 6日 | ||
應(yīng)用手冊(cè) | 設(shè)計(jì)電壓監(jiān)控器的電阻分壓器輸入端時(shí)的 IQ與精度權(quán)衡因素 (Rev. B) | PDF | HTML | 英語版 (Rev.B) | PDF | HTML | 2021年 10月 25日 | |
模擬設(shè)計(jì)期刊 | IQ:它是什么、不是什么以及如何使用 | 英語版 | 2011年 8月 17日 |
設(shè)計(jì)和開發(fā)
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封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
---|---|---|
VQFN (RHB) | 32 | Ultra Librarian |
訂購和質(zhì)量
包含信息:
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
包含信息:
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)