SMT & packaging application notes
Find documentation on TI’s surface mount technology (SMT) and application notes on a variety of packaging-related topics.
DSBGA
- NanoStar & NanoFree?(PDF, 750 KB)
- Micro SMD Wafer Level Chip Scale Package (small)?(PDF, 13.4 MB)
- Laminate CSP Application Note?(PDF, 28.9 MB)
- Mounting of Surface Components?(PDF, 5.6 MB)
- Thermal Derating Curves for Logic-Products Packages?(PDF, 70.5 KB)
- WCSP Handling Guide?(PDF, 944KB)
QFN
- Leadless Leadframe Package (LLP) Application Note?(PDF, 20.8 MB)
- Quad Flatpack No-Lead Logic Packages?(PDF, 1.0 MB)
- 56Pin Quad Flatpack No-Lead Logic Package?(PDF, 276 KB)
- Design Guide 92NLA Array QFN?(PDF, 1.1 KB)
- Design Summary Multi-row Quad Flat No-lead (MRQFN)?(PDF, 696 KB)
- Micro SMDxt Wafer Level Chip Scale Package (large)?(PDF, 6.1 KB)
- QFN/SON PCB Attachment Application?(PDF, 877 KB)
- Reworking LLP Chip Scale Package?(PDF, 146 KB)
- Soldering requirements for BQFN?(PDF, 753 KB)
- Surface Mount Package Removal?(PDF, 597 KB)
Leaded packages
- Land Pattern Recommendations?(PDF, 161 KB)
- PowerPAD Thermally enhanced package?(PDF, 906 KB)
BGA
- 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide?(PDF, 20.8 MB)
- 32 Bit Logic Familes in LFBGA Packages?(PDF, 1.0 MB)
- BGA Application Report for SMT?(PDF, 276 KB)
- Flip Chip BGA Package Reference?(PDF, 1.1 KB)
- nFBGA Packaging?(PDF, 696 KB)
- Plastic Ball Grid Array SMT Guideline?(PDF, 877 KB)
- Bumped Die Package?(PDF, 146 KB)
- PCB design guidelines for 0.4mm POP (Part 1)?(PDF, 753 KB)
- PCB design guidelines for 0.4mm POP (Part 2)?(PDF, 906 KB)
- TI OMAP POP SMT design guideline?(PDF, 161 KB)
- MicroStar BGA Packaging Reference Guide?(PDF, 76 KB)
Other packages
- TO-92?(PDF, 48 KB)
- FemtoFET SMT Guide?(PDF, 13.4 KB)
- Mounting Consideration for TO-3 Packages?(PDF, 13.4 MB)
- PowerFLEX Surface Mount Power Packaging?(PDF, 90 KB)
- PowerPaD Made Easy?(PDF, 20.8 MB)
- Thin Very Small-Outline Package TVSOP Application Report?(PDF, 1.0 MB)
- TO-247?(PDF, 1.1 KB)
- TO-263 THIN Package?(PDF, 276 KB)
- HotRod Design Guide?(PDF, 676 KB)
General packaging information
- Semiconductor Packaging Assembly Technology?(PDF, 270 KB)
- Absolute Maximum Ratings for Soldering?(PDF, 5.4 MB)
- Wave Solder Exposure of SMT Package?(PDF, 878 KB)
- External Lead Finish for Plastic Packages?(PDF,787 KB)
- Handling & Process Recommendations?(PDF, 324 KB)
- Plastic Package Moisture-Induced Cracking?(PDF, 565 KB)
- Pb-free and Pb Compatibility?(PDF, 3.2 MB)
- Electrical Performance of Packages?(PDF, 21.4 MB)
- EcoShip and EnviroPack: The Sustainable Solution for Storage and Shipping?(PDF)
Packaging reference guides
- Logic Packaging Migration?(PDF, 654 KB)
- Design Summary for MicroSiP - enabled TPS8267xSiP?(PDF, 321 KB)
- Analog and Logic Packaging?(PDF, 213 KB)
- PCB/Substrate Passive SMT Design Guidelines (PDF, 271 KB)
Image, thermal & electrical packages
- Recent Advancements in Bus-Interface Packing and Processing?(PDF, 546 KB)
- K-Factor Test-Board Design Impact on Thermal Impedance Measurements?(PDF, 787 KB)
- Package Thermal Characterization Methodologies?(PDF, 445 KB)
- Thermal Calculation Tools for Analog Components?(PDF, 544 KB)
- Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs?(PDF, 456 KB)
- Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices?(PDF, 27.4 MB)
- TMS320C6x Thermal Design Considerations?(PDF, 2.1 MB)
- Thermal Calculator Application Note?(PDF, 112 KB)
- IC Package Thermal Metrics?(PDF, 211 KB)
- A Guide to Board Layout for Best Thermal Resistance for Exposed Packages?(PDF, 672 KB)
- Understanding IC Package Power Capabilities?(PDF, 546 KB)
- Thermal Reference Sheet Analog?(PDF, 201 KB)
- How to Use a PowerPad Device?(PDF, 13.4 MB)
- How to use Psi-JT to calculate Junction Temperature?(PDF, 279 KB)
- Using Thermal Metrics for Power Devices?(PDF, 546 KB)