ZHCSGO5B June 2017 – March 2022 BQ25600 , BQ25600D
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Revision History
- 5 說(shuō)明（續(xù)）
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 Power-On-Reset (POR)
- 8.3.2 Device Power Up from Battery without Input Source
- 8.3.3 Power Up from Input Source
- 8.3.4 Boost Mode Operation From Battery
- 8.3.5 Host Mode and Standalone Power Management
- 8.3.6 Power Path Management
- 8.3.7 Battery Charging Management
- 8.3.8 Protections
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6 Register Maps
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- YFF|30
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
3 說(shuō)明
BQ25600 and BQ25600D 是高度集成的 3.0A 開(kāi)關(guān)模式電池充電管理和系統(tǒng)電源路徑管理器件，適用于單節(jié)鋰離子和鋰聚合物電池。其低阻抗電源路徑對(duì)開(kāi)關(guān)模式運(yùn)行效率進(jìn)行了優(yōu)化、縮短了電池充電時(shí)間并延長(zhǎng)了放電階段的電池使用壽命。具有充電和系統(tǒng)設(shè)置的 I2C 串行接口使得此器件成為一種真正靈活的解決方案。
器件信息
| 器件型號(hào) | 封裝(1) | 封裝尺寸（標(biāo)稱值） |
|---|---|---|
| BQ25600 | WCSP (30) | 2.00mm × 2.40mm |
| BQ25600D |
(1) 如需了解所有可用封裝，請(qǐng)參閱數(shù)據(jù)表末尾的可訂購(gòu)產(chǎn)品附錄。
簡(jiǎn)化版應(yīng)用