ZHCSGR3C May 2017 – September 2021 BQ25606
PRODUCTION DATA
| THERMAL METRIC (1) | BQ25606 | UNIT | |
|---|---|---|---|
| RGE (VQFN) | |||
| 24 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 27 | °C/W |
| RθJB | Junction-to-board thermal resistance | 9.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 9.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.8 | °C/W |