ZHCS343C May 2012 – January 2023 DRV2665
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 Support for Haptic Piezo Actuators
- 7.3.2 Flexible Front End Interface
- 7.3.3 Ramp Down Behavior
- 7.3.4 Low Latency Startup
- 7.3.5 Low Power Standby Mode
- 7.3.6 Device Reset
- 7.3.7 Amplifier Gain
- 7.3.8 Adjustable Boost Voltage
- 7.3.9 Adjustable Current Limit
- 7.3.10 Internal Charge Pump
- 7.3.11 Device Protection
- 7.4 Device Functional Modes
- 7.5 Programming
- 7.6 Register Map
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
- RGP|20
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RGP|20
訂購信息
7.5.1 Programming the Boost Voltage
The boost output voltage is programmed through two external resistors as shown in Figure 7-3. The boost output voltage is given by Equation 1.
Figure 7-3 FB Network
where
- V(FB) = 1.32 V
V(BST) must be programmed to a value of 5.0 V greater than the largest peak voltage expected in the system to allow adequate amplifier headroom. Because the programming range for the boost voltage extends to 105 V, the leakage current through the resistor divider can become significant. It is recommended that the sum of the resistances R1 + R2 be greater than 400 kΩ. When resistor values greater than 1 MΩ are used, PCB contamination may cause boost voltage inaccuracy. Exercise caution when soldering large resistances, and clean the area when finished for best results. Table 7-2 shows examples on how to configure the device for different output voltages.
| R1 | R2 | GAIN[1:0] | V(BST) | FULL SCALE PEAK VOLTAGE (V) |
|---|---|---|---|---|
| 402 kΩ | 18.2 kΩ | 00 | 30 | 25 |
| 392 kΩ | 9.76 kΩ | 01 | 55 | 50 |
| 768 kΩ | 13 kΩ | 10 | 80 | 75 |
| 768 kΩ | 9.76 kΩ | 11 | 105 | 100 |