ZHCSJ12Z October 1979 – May 2025 LM139 , LM139A , LM239 , LM239A , LM2901 , LM2901AV , LM2901B , LM2901V , LM339 , LM339A , LM339B
PRODMIX
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | All Devices | UNIT | ||||||
|---|---|---|---|---|---|---|---|---|
| N (PDIP) |
D (SOIC) |
PW (TSSOP) |
DB (SSOP) |
NS (SOP) |
RTE (QFN) |
|||
| 14 PINS | 14 PINS | 14 PINS | 14 PINS | 14 PINS | 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 114.9 | 111.2 | 136.6 | 111.8 | 96.2 | 67.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 93.8 | 66.9 | 66.6 | 63.6 | 56.1 | 72.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 77.7 | 67.8 | 79.8 | 60.5 | 56.9 | 43.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 60.4 | 28.0 | 17.8 | 26.2 | 24.8 | 6.3 | °C/W |
| ψJB | Junction-to-board characterization parameter | 76.7 | 67.4 | 79.3 | 58.5 | 56.4 | 42.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | - | - | - | - | - | 26.4 | °C/W |