ZHCSGV4J September 2017 – November 2024 TLV7031 , TLV7032 , TLV7034 , TLV7041 , TLV7042 , TLV7044
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Pin Configuration and Functions
-
5 Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Thermal Information (Single)
- 5.5 Thermal Information (Dual)
- 5.6 Thermal Information (Quad)
- 5.7 Electrical Characteristics (Single)
- 5.8 Switching Characteristics (Single)
- 5.9 Electrical Characteristics (Dual)
- 5.10 Switching Characteristics (Dual)
- 5.11 Electrical Characteristics (Quad)
- 5.12 Switching Characteristics (Quad)
- 5.13 Timing Diagrams
- 5.14 Typical Characteristics
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RTE|16
訂購信息
4.2 Pin Functions: TLV7032/42 Dual
 Figure 4-5 TLV7032/42 DGK, DDF Packages 8-Pin VSSOP, SOT-23 Top View |  A. Connect thermal pad directly to V– pad. Figure 4-6 TLV7032/42 DSG Package 8-Pin WSON With Exposed Thermal Pad Top View |
Table 4-2 Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| INA– | 2 | I | Inverting input, channel A |
| INA+ | 3 | I | Noninverting input, channel A |
| INB– | 6 | I | Inverting input, channel B |
| INB+ | 5 | I | Noninverting input, channel B |
| OUTA | 1 | O | Output, channel A |
| OUTB | 7 | O | Output, channel B |
| VEE | 4 | — | Negative (lowest) supply or ground (for single-supply operation) |
| VCC | 8 | — | Positive (highest) supply |