7.2 ESD Ratings(3)
|
VALUE |
UNIT |
| V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) |
±2500 |
V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) |
±1000 |
| IEC (4) 61000-4-2 contact discharge, CC1, CC2 |
±8000 |
| IEC (4) 61000-4-2 air-gap discharge, CC1, CC2 |
±15000 |
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
(4) These results were passing limits that were obtained on an application-level test board. Individual results may vary based on implementation. Surges per IEC61000-4-2, 1999 applied between CC1/CC2 and ground of TPS25740BEVM-741 and TPS25740BEVM-741