ZHCSTM4A October 2023 – March 2024 TPS25751
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Recommended Capacitance
- 6.5 Thermal Information
- 6.6 Power Supply Characteristics
- 6.7 Power Consumption
- 6.8 PP_5V Power Switch Characteristics
- 6.9 PPHV Power Switch Characteristics - TPS25751D
- 6.10 PP_EXT Power Switch Characteristics - TPS25751S
- 6.11 Power Path Supervisory
- 6.12 CC Cable Detection Parameters
- 6.13 CC VCONN Parameters
- 6.14 CC PHY Parameters
- 6.15 Thermal Shutdown Characteristics
- 6.16 ADC Characteristics
- 6.17 Input/Output (I/O) Characteristics
- 6.18 BC1.2 Characteristics
- 6.19 I2C Requirements and Characteristics
- 6.20 Typical Characteristics
- 7 Parameter Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 USB-PD Physical Layer
- 8.3.2 Power Management
- 8.3.3 Power Paths
- 8.3.4 Cable Plug and Orientation Detection
- 8.3.5 Overvoltage Protection (CC1, CC2)
- 8.3.6 Default Behavior Configuration (ADCIN1, ADCIN2)
- 8.3.7 ADC
- 8.3.8 BC 1.2 (USB_P, USB_N)
- 8.3.9 Digital Interfaces
- 8.3.10 Digital Core
- 8.3.11 I2C Interface
- 8.4 Device Functional Modes
- 8.5 Thermal Shutdown
-
9 Application and Implementation
- 9.1 Application Information
- 9.2 Typical Application
- 9.3 Power Supply Recommendations
- 9.4
Layout
- 9.4.1 TPS25751D - Layout
- 9.4.2 TPS25751S - Layout
- 10Device and Documentation Support
- 11Revision History
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSM|32
訂購(gòu)信息
5 Pin Configuration and Functions
Figure 5-1 Top View of the TPS25751D 38-pin QFN
Package
Figure 5-2 Top View of
the TPS25751S 32-pin QFN
PackageTable 5-1 TPS25751D Pin
Functions
| PIN | TYPE(1) | RESET | DESCRIPTION | |
|---|---|---|---|---|
| NAME | NO. | |||
| ADCIN1 | 2 | I | Hi-Z | Configuration Input. Connect to a resistor divider to LDO_3V3. |
| ADCIN2 | 3 | I | Hi-Z | Configuration Input. Connect to a resistor divider to LDO_3V3. |
| CC1 | 28 | I/O | Hi-Z | I/O for USB Type-C. Filter noise with recommended capacitor to GND (CCCy). |
| CC2 | 29 | I/O | Hi-Z | I/O for USB Type-C. Filter noise with recommended capacitor to GND (CCCy). |
| GND | 11, 12, 14, 31 | — | — | Ground. Connect to ground plane. |
| GPIO0 | 5 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO1 | 6 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO2 | 7 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO3 | 19 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO4/USB_P/LD1 | 26 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when unused. Pin can be connected to D+ for BC1.2 support. Pin can be connected for liquid detection on the Type-C connector. Tie to ground when pin is unused. |
| GPIO5/USB_N/LD2 | 27 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when unused. Pin can be connected to D- for BC1.2 support. Pin can be connected for liquid detection on the Type-C connector. Tie to ground when pin is unused. |
| GPIO6 | 37 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO7 | 36 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| I2Ct_SCL | 9 | I | Hi-Z | I2C target serial clock input. Tie to pullup voltage through a resistor. May be grounded if unused. |
| I2Ct_SDA | 8 | I/O | Hi-Z | I2C target serial data. Open-drain input/output. Tie to pullup voltage through a resistor. May be grounded if unused. |
| I2Ct_IRQ | 10 | O | Hi-Z | I2C target interrupt. Active low. Connect to external voltage through a pull-up resistor. Pin can be re-configured to GPIO10. Tie to ground if unused. |
| I2Cc_SCL | 17 | O | Hi-Z | I2C controller serial clock. Open-drain output. Tie to pullup voltage through a resistor. Can be grounded if unused. |
| GPIO11 | 13 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| I2Cc_SDA | 16 | I/O | Hi-Z | I2C controller serial data. Open-drain input/output. Tie to pullup voltage through a resistor. Can be grounded if unused. |
| I2Cc_IRQ | 18 | I | Hi-Z | I2C controller interrupt. Active low. Connect to external voltage through a pull-up resistor. Do NOT tie to GND when unused. Pin can be re-configured to GPIO12. |
| LDO_1V5 | 4 | O | — | Output of the CORE LDO. Bypass with capacitance CLDO_1V5 to GND. Pin cannot source current to external circuits. |
| LDO_3V3 | 1 | O | — | Output of supply switched from VIN_3V3 or VBUS LDO. Bypass with capacitance CLDO_3V3 to GND. |
| DRAIN | 15, 30 | N/A | — | Connects to drain of internal FET. |
| PP5V | 34, 35 | I | — | 5-V System Supply to VBUS, supply for CCy pins as VCONN. |
| PPHV | 20, 21, 22 | I/O | High-voltage sinking node in the system. | |
| VBUS_IN | 23, 24, 25 | I/O | 5-V to 20-V input. | |
| VBUS | 32, 33 | O | 5-V output from PP5V input to LDO. Bypass with capacitance CVBUS to GND. | |
| VIN_3V3 | 38 | I | — | Supply for core circuitry and I/O. Bypass with capacitance CVIN_3V3 to GND. |
(1) I = input, O = output, I/O = input and output, GPIO = general purpose
digital input and output
Table 5-2 TPS25751S Pin
Functions
| PIN | TYPE(1) | RESET | DESCRIPTION | |
|---|---|---|---|---|
| NAME | NO. | |||
| ADCIN1 | 2 | I | Hi-Z | Configuration Input. Connect to a resistor divider to LDO_3V3. |
| ADCIN2 | 3 | I | Hi-Z | Configuration Input. Connect to a resistor divider to LDO_3V3. |
| CC1 | 24 | I/O | Hi-Z | I/O for USB Type-C. Filter noise with recommended capacitor to GND (CCCy). |
| CC2 | 25 | I/O | Hi-Z | I/O for USB Type-C. Filter noise with recommended capacitor to GND (CCCy). |
| GATE_VSYS | 20 | O | Hi-Z | Connect to the N-ch MOSFET that has source tied to VSYS. |
| GATE_VBUS | 21 | O | Hi-Z | Connect to the N-ch MOSFET that has source tied to VBUS. |
| GND | 11, 12, 14 | — | — | Ground. Connect to ground plane. |
| GPIO0 | 5 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO1 | 6 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO2 | 7 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO3 | 18 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO4/USB_P/LD1 | 22 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when unused. Pin can be connected to D+ for BC1.2 support. Pin can be connected for liquid detection on the Type-C connector. Tie to ground when pin is unused. |
| GPIO5/USB_N/LD2 | 23 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when unused. Pin can be connected to D- for BC1.2 support. Pin can be connected for liquid detection on the Type-C connector. Tie to ground when pin is unused. |
| GPIO6 | 31 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| GPIO7 | 30 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| I2Ct_SCL | 9 | I | Hi-Z | I2C target serial clock input. Tie to pullup voltage through a resistor. May be grounded if unused. |
| I2Ct_SDA | 8 | I/O | Hi-Z | I2C target serial data. Open-drain input/output. Tie to pullup voltage through a resistor. May be grounded if unused. |
| I2Ct_IRQ | 10 | O | Hi-Z | I2C target interrupt. Active low. Connect to external voltage through a pull-up resistor. Pin can be re-configured to GPIO10. Tie to ground when unused. |
| I2Cc_SCL | 16 | O | Hi-Z | I2C controller serial clock. Open-drain output. Tie to pullup voltage through a resistor when used or unused. |
| GPIO11 | 13 | GPIO | Hi-Z | General purpose digital I/O. Tie to ground when pin is unused. |
| I2Cc_SDA | 15 | I/O | Hi-Z | I2C controller serial data. Open-drain input/output. Tie to pullup voltage through a resistor when used or unused. |
| I2Cc_IRQ | 17 | I | Hi-Z | I2C controller interrupt. Active low. Connect to external voltage through a pull-up resistor. Do NOT tie to GND when unused. Pin can be re-configured to GPIO12. |
| LDO_1V5 | 4 | O | — | Output of the CORE LDO. Bypass with capacitance CLDO_1V5 to GND. Pin cannot source current to external circuits. |
| LDO_3V3 | 1 | O | — | Output of supply switched from VIN_3V3 or VBUS LDO. Bypass with capacitance CLDO_3V3 to GND. |
| PP5V | 28, 29 | I | — | 5-V System Supply to VBUS, supply for CCy pins as VCONN. |
| VSYS | 19 | I | — | High-voltage sinking node in the system. Pin is used to implement reverse-current-protection (RCP) for the external sinking paths controlled by GATE_VSYS. |
| VBUS | 26, 27 | I/O | 5-V to 20-V input. Bypass with capacitance CVBUS to GND. | |
| VIN_3V3 | 32 | I | — | Supply for core circuitry and I/O. Bypass with capacitance CVIN_3V3 to GND. |
(1) I = input, O = output, I/O = input and
output, GPIO = general purpose digital input and output