SLVS363G August 2001 – September 2016 TPS3103 , TPS3106 , TPS3110
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Available Options
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請(qǐng)參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DBV|6
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
11 Layout
11.1 Layout Guidelines
Follow these guidelines to lay out the printed-circuit-board (PCB) that is used for the TPS310x and TPS3110x family of devices.
- Place the VDD decoupling capacitor close to the device.
- Avoid using long traces for the VCC supply node. The VCC capacitor (CVDD), along with parasitic inductance from the supply to the capacitor, can form an LC tank and create ringing with peak voltages above the maximum VDD voltage.
11.2 Layout Example
Figure 19. Example Layout (DBV Package)