SLVS806D April 2009 – December 2015 TPS61240 , TPS61241
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Device Options
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Parameter Measurement Information
- 9 Detailed Description
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DRV|6
訂購(gòu)信息
12 Layout
12.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground tracks. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC. The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the control ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids ground shift problems, which can occur due to superimposition of power ground current and control ground current.
12.2 Layout Example
Figure 22. Suggested Layout (Top)
12.3 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the power- dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below:
- Improving the power dissipation capability of the PCB design
- For example, increase of the GND plane on the top layer which is connected to the exposed thermal pad
- Use thicker copper layer
- Improving the thermal coupling of the component to the PCB
- Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6124x is 105°C. The thermal resistance of the 6-pin CSP package (YFF-6) is RθJA = 133 °C/W. Regulator operation is specified to a maximum steady-state ambient temperature TA of 85°C. Therefore, the maximum power dissipation is about 150 mW.