TMS320C5504
- High-Performance, Low-Power, TMS320C55x? Fixed-Point Digital Signal Processor
- 16.67-, 13.33-, 10-, 8.33-, 6.66-ns Instruction Cycle Time
- 60-, 75-, 100-, 120-, 150-MHz Clock Rate
- One/Two Instructions Executed per Cycle
- Dual Multipliers [Up to 200, 240, or 300 Million Multiply-Accumulates per Second (MMACS)]
- Two Arithmetic/Logic Units (ALUs)
- Three Internal Data/Operand Read Buses and Two Internal Data/Operand Write Buses
- Software-Compatible With C55x Devices
- Industrial Temperature Devices Available
- 256K Bytes Zero-Wait State On-Chip RAM, Composed of:
- 64K Bytes of Dual-Access RAM (DARAM), 8 Blocks of 4K x 16-Bit
- 192K Bytes of Single-Access RAM (SARAM), 24 Blocks of 4K x 16-Bit
- 128K Bytes of Zero Wait-State On-Chip ROM
(4 Blocks of 16K x 16-Bit) - 4M x 16-Bit Maximum Addressable External Memory Space (SDRAM/mSDRAM)
- 16-/8-Bit External Memory Interface (EMIF) with Glueless Interface to:
- 8-/16-Bit NAND Flash, 1- and 4-Bit ECC
- 8-/16-Bit NOR Flash
- Asynchronous Static RAM (SRAM)
- 16-bit SDRAM/mSDRAM (1.8-, 2.5-, 2.75-, and 3.3-V)
- Direct Memory Access (DMA) Controller
- Four DMA With 4 Channels Each (16-Channels Total)
- Three 32-Bit General-Purpose Timers
- One Selectable as a Watchdog and/or GP
- Two MultiMedia Card/Secure Digital (MMC/SD) Interfaces
- Universal Asynchronous Receiver/Transmitter (UART)
- Serial-Port Interface (SPI) With Four Chip-Selects
- Master/Slave Inter-Integrated Circuit (I2C Bus?)
- Four Inter-IC Sound (I2S Bus?) for Data Transport
- Device USB Port With Integrated 2.0 High-Speed PHY that Supports:
- USB 2.0 Full- and High-Speed Device
- Real-Time Clock (RTC) With Crystal Input, With Separate Clock Domain and Power Supply
- Four Core Isolated Power Supply Domains: Analog, RTC, CPU and Peripherals, and USB
- Four I/O Isolated Power Supply Domains: RTC I/O, EMIF I/O, USB PHY, and DVDDIO
- One integrated LDO (ANA_LDO) to power DSP PLL (VDDA_PLL)
- Low-Power S/W Programmable Phase-Locked Loop (PLL) Clock Generator
- On-Chip ROM Bootloader (RBL) to Boot From NAND Flash, NOR Flash, SPI EEPROM, SPI Serial Flash or I2C EEPROM
- IEEE-1149.1 (JTAG)
Boundary-Scan-Compatible - Up to 26 General-Purpose I/O (GPIO) Pins
(Multiplexed With Other Device Functions) - 196-Terminal Pb-Free Plastic BGA (Ball Grid Array) (ZCH Suffix)
- 1.05-V Core (60 or 75 MHz), 1.8-V, 2.5-V, 2.75-V, or 3.3-V I/Os
- 1.3-V Core (100, 120 MHz), 1.8-V, 2.5-V, 2.75-V, or 3.3-V I/Os
- 1.4-V Core (150 MHz), 1.8-V, 2.5-V, 2.75-V or 3.3-V I/Os
All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
The device is a member of TI's TMS320C5000™ fixed-point Digital Signal Processor (DSP) product family and is designed for low-power applications.
The fixed-point DSP is based on the TMS320C55x™ DSP generation CPU processor core. The C55x™ DSP architecture achieves high performance and low power through increased parallelism and total focus on power savings. The CPU supports an internal bus structure that is composed of one program bus, one 32-bit data read bus and two 16-bit data read buses, two 16-bit data write buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to four 16-bit data reads and two 16-bit data writes in a single cycle. The device also includes four DMA controllers, each with 4 channels, providing data movement for 16-independent channel contexts without CPU intervention. Each DMA controller can perform one 32-bit data transfer per cycle, in parallel and independent of the CPU activity.
The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication and a 32-bit add in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of the ALUs is under instruction set control, providing the ability to optimize parallel activity and power consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU.
The C55x CPU supports a variable byte width instruction set for improved code density. The Instruction Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to the Address Unit (AU) and Data Unit (DU) resources, and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution of conditional instructions.
Serial media is supported through two MultiMedia Card/Secure Digital (MMC/SD) peripherals, four Inter-IC Sound (I2S Bus™) modules, one Serial-Port Interface (SPI) with up to 4 chip selects, one I2C multi-master and slave interface, and a Universal Asynchronous Receiver/Transmitter (UART) interface.
The device peripheral set includes an external memory interface (EMIF) that provides glueless access to asynchronous memories like EPROM, NOR, NAND, and SRAM, as well as to high-speed, high-density memories such as synchronous DRAM (SDRAM) and mobile SDRAM (mSDRAM). Additional peripherals include: a high-speed Universal Serial Bus (USB2.0) device mode only, and a real-time clock (RTC). This device also includes three general-purpose timers with one configurable as a watchdog timer, and an analog phase-locked loop (APLL) clock generator.
The device includes one integrated LDO (ANA_LDO) to provide regulated 1.3 V to the DSP PLL (VDDA_PLL). Note: ANA_LDO can only provide a regulated 1.3 V. When the DSP PLL requires 1.4 V (PLLOUT > 120 MHz), an external supply is required to supply 1.4 V to the DSP PLL (VDDA_PLL).
The device is supported by the industry’s award-winning eXpressDSP™, Code Composer Studio™ Integrated Development Environment (IDE), DSP/BIOS™, Texas Instruments’ algorithm standard, and the industry’s largest third-party network. Code Composer Studio IDE features code generation tools including a C Compiler and Linker, RTDX™, XDS100™, XDS510™, XDS560™ emulation device drivers, and evaluation modules. The device is also supported by the C55x DSP Library which features more than 50 foundational software kernels (FIR filters, IIR filters, and various math functions) as well as chip support libraries.

TI 僅提供有限的設(shè)計(jì)支持
該產(chǎn)品對現(xiàn)有工程提供的 TI 設(shè)計(jì)支持有限。如可用,您將在產(chǎn)品文件夾中找到相關(guān)的配套資料、軟件和工具。對于使用該產(chǎn)品的現(xiàn)有設(shè)計(jì),您可以在 TI E2ETM 支持論壇中申請支持,但針對該產(chǎn)品提供的支持有限。
技術(shù)文檔
設(shè)計(jì)和開發(fā)
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TMDSEMU200-U — XDS200 USB 調(diào)試探針
XDS200 是用于調(diào)試 TI 嵌入式器件的調(diào)試探針(仿真器)。與低成本的 XDS110 和高性能的 XDS560v2 相比,XDS200 在低成本和高性能之間實(shí)現(xiàn)了平衡;并在單個(gè)倉體中支持廣泛的標(biāo)準(zhǔn)(IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 調(diào)試探針在所有具有嵌入式跟蹤緩沖器 (ETB) 的 Arm® 和 DSP 處理器中均支持內(nèi)核和系統(tǒng)跟蹤。對于引腳上的內(nèi)核跟蹤,則需要使用 XDS560v2 PRO TRACE。
XDS200 通過 TI 20 引腳連接器(帶有適用于 TI 14 引腳、Arm Cortex® 10 引腳和 Arm 20 (...)
TMDSEMU560V2STM-U — XDS560? 軟件 v2 系統(tǒng)跟蹤 USB 調(diào)試探針
XDS560v2 是 XDS560™ 系列調(diào)試探針中性能非常出色的產(chǎn)品,同時(shí)支持傳統(tǒng) JTAG 標(biāo)準(zhǔn) (IEEE1149.1) 和 cJTAG (IEEE1149.7)。請注意,它不支持串行線調(diào)試 (SWD)。
所有 XDS 調(diào)試探針在所有具有嵌入式跟蹤緩沖器 (ETB) 的 ARM 和 DSP 處理器中均支持內(nèi)核和系統(tǒng)跟蹤。對于引腳上的跟蹤,需要 XDS560v2 PRO TRACE。
XDS560v2 通過 MIPI HSPT 60 引腳連接器(帶有多個(gè)用于 TI 14 引腳、TI 20 引腳和 ARM 20 引腳的適配器)連接到目標(biāo)板,并通過 USB2.0 高速 (480Mbps) (...)
TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系統(tǒng)跟蹤 USB 和以太網(wǎng)
XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 處理器調(diào)試探針(仿真器)的第一種型號。XDS560v2 是 XDS 系列調(diào)試探針中性能最高的一款,同時(shí)支持傳統(tǒng) JTAG 標(biāo)準(zhǔn) (IEEE1149.1) 和 cJTAG (IEEE1149.7)。
XDS560v2 System Trace 在其巨大的外部存儲器緩沖區(qū)中加入了系統(tǒng)引腳跟蹤。這種外部存儲器緩沖區(qū)適用于指定的 TI 器件,通過捕獲相關(guān)器件級信息,獲得準(zhǔn)確的總線性能活動(dòng)和吞吐量,并對內(nèi)核和外設(shè)進(jìn)行電源管理。此外,對于帶有嵌入式緩沖跟蹤器 (ETB) 的所有 ARM 和 DSP 處理器,所有 XDS (...)
LB-3P-TRACE32-DSP — 適用于數(shù)字信號處理器 (DSP) 的 Lauterbach TRACE32 調(diào)試和跟蹤系統(tǒng)
Lauterbach‘s TRACE32? tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of single- or multi-core Digital Signal processors (DSPs) which are a popular choice for audio and video processing as well as radar data (...)
C55XCSL-LOWPOWER — 適用于 C5504/05、C5514/15/17 和 C5535/45 器件的 TMS320C55x 芯片支持庫
The C55x Chip Support Libraries (CSL) provide an application programming interface (API) used for configuring and controlling the DSP on-chip peripherals for ease of use, compatibility between various C55x devices and hardware abstraction. CSLs will shorten development time by providing (...)
支持的產(chǎn)品和硬件
產(chǎn)品
數(shù)字信號處理器 (DSP)
SPRC264 — TMS320C5000/6000 圖像庫 (IMGLIB)
請參閱基準(zhǔn)測試:DSP 內(nèi)核基準(zhǔn)測試
TELECOMLIB — 用于 TMS320C64x+ 和 TMS320C55x 處理器的電信和媒體庫 - FAXLIB、VoLIB 和 AEC/AER
CCSTUDIO — Code Composer Studio 集成式開發(fā)環(huán)境 (IDE)
Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows?, Linux? and macOS? platforms.
(...)
支持的產(chǎn)品和硬件
此設(shè)計(jì)資源支持這些類別中的大部分產(chǎn)品。
查看產(chǎn)品詳情頁,驗(yàn)證是否能提供支持。
-
parametric-filter 數(shù)字信號處理器 (DSP) -
parametric-filter 基于 Arm 的處理器 -
parametric-filter MSP430 微控制器 -
parametric-filter C2000 實(shí)時(shí)微控制器 -
parametric-filter 基于 Arm 的微控制器 -
parametric-filter 信號調(diào)節(jié)器 -
parametric-filter 毫米波雷達(dá)傳感器 -
parametric-filter Zigbee 產(chǎn)品 -
parametric-filter Wi-Fi 產(chǎn)品 -
parametric-filter Thread 產(chǎn)品 -
parametric-filter 其他無線技術(shù) -
parametric-filter 低于 1GHz 產(chǎn)品 -
parametric-filter 多協(xié)議產(chǎn)品 -
parametric-filter 藍(lán)牙產(chǎn)品 -
parametric-filter 數(shù)字電源隔離式控制器
ADT-3P-DSPVOIPCODECS — 自適應(yīng)數(shù)字技術(shù) DSP VOIP、語音和音頻編解碼器
如需了解有關(guān) Adaptive Digital 的更多信息,請?jiān)L問 https://www.adaptivedigital.com。
ALGOT-3P-DSPVOIPCODECS — Algotron C5000 DSP 電信和音頻編解碼器
如需了解有關(guān) Algotron 的更多信息,請?jiān)L問 http://www.algotron.com/audio/audio_sum.htm。
C55XCODECS — 編解碼器 - 針對 C55x 器件進(jìn)行了優(yōu)化
其它信息:
- DSP 和 ARM 編解碼器 - 當(dāng)前庫存 - 所有 TI 編解碼器
- TI E2E? 社區(qū)
DSPI-3P-DSPVOIPCODECS — DSP 創(chuàng)新:DSP VoIP 編解碼器
如需了解有關(guān) DSP Innovations 的更多信息,請?jiān)L問:http://dspini.com。
封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
---|---|---|
NFBGA (ZCH) | 196 | Ultra Librarian |
訂購和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)