ZHCSKO3B January 2020 – September 2020 BQ25611D
PRODUCTION DATA
THERMAL METRIC(1) | BQ25611D | UNIT | |
---|---|---|---|
RTW (WQFN) | |||
24 Pins | |||
RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 35.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 22.7 | °C/W |
RθJB | Junction-to-board thermal resistance | 11.9 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 1.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.6 | °C/W |