ZHCSLZ2B October 2022 – September 2023 TLV1811-Q1 , TLV1812-Q1 , TLV1814-Q1 , TLV1821-Q1 , TLV1822-Q1 , TLV1824-Q1
PRODMIX
| THERMAL METRIC(1) | TLV18x1-Q1 | UNIT | ||
|---|---|---|---|---|
| DCK (SC-70) | DBV (SOT-23) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 226.6 | 203.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 129.5 | 105.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 78.6 | 106.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 51.5 | 54.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 78.3 | 106.0 | °C/W |