ZHCSI62J August 2018 – February 2024 TLV9051 , TLV9052 , TLV9054
PRODUCTION DATA
| THERMAL METRIC(1) | TLV9051, TLV9051S | UNIT | |||||
|---|---|---|---|---|---|---|---|
| DPW (X2SON) | DBV (SOT-23) | DCK (SC70) | DRL (SOT553)(2) | ||||
| 5 PINS | 5 PINS | 6 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 470.0 | 228.1 | 210.8 | 231.2 | TBD | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 211.9 | 152.1 | 152.1 | 144.4 | TBD | °C/W |
| RθJB | Junction-to-board thermal resistance | 334.8 | 97.7 | 92.3 | 78.6 | TBD | °C/W |
| ψJT | Junction-to-top characterization parameter | 29.8 | 74.1 | 76.2 | 51.3 | TBD | °C/W |
| ψJB | Junction-to-board characterization parameter | 333.2 | 97.3 | 92.1 | 78.3 | TBD | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | N/A | N/A | N/A | TBD | °C/W |