1 Overview

This document contains information for TMCS1123-Q1, TMCS1126-Q1, TMCS1127-Q1, and TMCS1133-Q1 (SOIC package) to aid in a functional safety system design. Information provided are:

• Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
• Component failure modes and their distribution (FMD) based on the primary function of the device
• Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram of TMCS1123-Q1 for reference. Refer to the individual data sheets for the function block diagram of the actual product.

The TMCS1123-Q1, TMCS1126-Q1, TMCS1127-Q1, and TMCS1133-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.