4 Revision History
Changes from Revision D (September 2015) to Revision E (December 2020)
- 注:采用 MicroStar Jr. BGA 封裝的器件采用層壓 nFBGA 封裝進行了重新設(shè)計。這種 nFBGA 封裝提供了類似于數(shù)據(jù)表中的電氣性能。該封裝占用空間也類似于 MicroStar Jr. BGA。將在整個數(shù)據(jù)表中更新全新封裝標識符來代替已停止使用的封裝標識符。Go
- 將 u*jr ZQE 更改為 nFBGA ZXHGo
- Changed u*jr ZQE to nFBGA ZXHGo
- Changed u*jr ZQE to nFBGA ZXHGo
- Changed u*jr ZQE to nFBGA ZXHGo
- Changed u*jr ZQE to nFBGA ZXHGo
- Changed u*jr ZQE to nFBGA ZXH. Updated thermal
data.Go
- Changed u*jr ZQE to nFBGA ZXHGo
- Changed u*jr ZQE to nFBGA ZXHGo
Changes from Revision C (August 2015) to Revision D (September 2015)
- 將 節(jié) 3 文本字符串從“....DisplayPort 1.2a...”更改為“...DisplayPort HBR2...”,以及從“..HDMI2.0..”更改為“...HDMI...”Go
- Deleted RθJC(bot) spec from Thermal Information table as N/AGo
- Deleted "Operating free air temperature" spec from Electrical Characteristics tableGo
- Changed Figure 9-5
Go
- Changed Section 10 text string from "Decoupling capacitors may be used to reduce noise and improve power supply integrity" to "Decoupling capacitors must be used to reduce power supply noise"Go
Changes from Revision B (July 2015) to Revision C (July 2015)
- Added ton(OE_L-H), toff(OE_H-L), and tSWITCH_OVER to the
Section 7.7
Go
Changes from Revision * (May 2014) to Revision A (May 2014)