ZHCSL79D May 2020 – February 2023 TLV7031-Q1 , TLV7032-Q1 , TLV7034-Q1 , TLV7041-Q1 , TLV7042-Q1 , TLV7044-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | TLV7032/TLV7042 | UNIT | ||
|---|---|---|---|---|
| DGK (VSSOP) | DDF (SOT-23) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 211.7 | 212.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 96.1 | 127.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 133.5 | 129.2 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 28.3 | 25.8 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 131.7 | 129.0 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |