SLUSFS4A September 2025 – September 2025 UCC27734-Q1 , UCC27735-Q1
PRODUCTION DATA
THERMAL METRIC(1) | UCC27734-Q1 | UCC27735-Q1 | UNIT | |
---|---|---|---|---|
(SOIC) | (SOIC) | |||
8 PINS | 14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 112.2 | 80.6 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 52.1 | 41.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 60.8 | 40.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 7.5 | 6.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 60.0 | 39.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |