ZHCSH33Z September 1997 – April 2025 LM317
PRODUCTION DATA
| THERMAL METRIC (1)(2) | LM317 | UNIT | ||
|---|---|---|---|---|
| DCY (SOT-223) |
KTT (TO-263) |
|||
| 4 PINS | 3 PINS | |||
| Rθ(JA) | Junction-to-ambient thermal resistance | 59.6 | 41.0 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 39.3 | 43.6 | °C/W |
| RθJB | Junction-to-board thermal resistance | 8.4 | 23.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.8 | 10.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 8.3 | 22.6 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | 0.9 | °C/W |