ZHCSH33Z September 1997 – April 2025 LM317
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
-
8 Application and Implementation
- 8.1 Application Information
- 8.2 Typical Application
- 8.3
System Examples
- 8.3.1 0V to 30V Regulator Circuit
- 8.3.2 Adjustable Regulator Circuit With Improved Ripple Rejection
- 8.3.3 Precision Current-Limiter Circuit
- 8.3.4 Tracking Preregulator Circuit
- 8.3.5 1.25V to 20V Regulator Circuit With Minimum Program Current
- 8.3.6 Battery-Charger Circuit
- 8.3.7 50mA, Constant-Current, Battery-Charger Circuit
- 8.3.8 Slow Turn-On 15V Regulator Circuit
- 8.3.9 AC Voltage-Regulator Circuit
- 8.3.10 Current-Limited 6V Charger Circuit
- 8.3.11 Adjustable 4A Regulator Circuit
- 8.3.12 High-Current Adjustable Regulator Circuit
- 8.4 Power Supply Recommendations
- 8.5 Layout
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
8.5.1.1.2.2 Heat Sinking the TO-263 (KTT) Package
Figure 8-19 shows the TO-263 measured values of RθJA for different copper area sizes using a typical PCB with 1oz. copper. This figure also shows no solder mask over the copper area used for heat sinking.
As shown in Figure 8-21, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value of RθJA for the TO-263 package mounted to a PCB is 32°C/W.
Figure 8-21 RθJA vs Copper (1-oz.) Area for the TO-263 PackageAs a design aid, Figure 8-22 shows the maximum allowable power dissipation compared to ambient temperature for the TO-263 device. This figure assumes RθJA is 35°C/W and the maximum junction temperature is 125°C.
Figure 8-22 Maximum Power Dissipation vs TAMB for the TO-263 Package