SBASAZ5A October 2024 – September 2025 AMC0386-Q1
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics
- 6.10 Switching Characteristics
- 6.11 Timing Diagrams
- 6.12 Insulation Characteristics Curves
- 6.13 Typical Characteristics
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Revision History
- 11Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- DFX|15
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
7.3.3 Isolation Channel Signal Transmission
As shown in Figure 7-3, the AMC0386-Q1 uses an on-off keying (OOK) modulation scheme to transmit the modulator output bitstream across the SiO2-based isolation barrier. The transmit driver (TX) is illustrated in the Functional Block Diagram. TX transmits an internally generated, high-frequency carrier across the isolation barrier to represent a digital one. However, TX does not send a signal to represent a digital zero. The nominal frequency of the carrier used inside the AMC0386-Q1 is 480MHz.
The AMC0386-Q1 transmission channel is optimized to achieve the highest level of common-mode transient immunity (CMTI) and the lowest level of radiated emissions. The high-frequency carrier and RX/TX buffer switching cause these emissions.
Figure 7-3 OOK-Based Modulation
Scheme