SBASAZ5A October 2024 – September 2025 AMC0386-Q1
PRODUCTION DATA
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | DFX (SSOP) | UNIT | |
|---|---|---|---|
| 15 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 86.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 36.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 43.5 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 17 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 41.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |